HySum Showcases High-Performance Functional Film Solutions at Filmtech Japan, Highlighting Breakthroughs in Electronics and Semiconductor Materials

In mid-November, HySum New Materials participated in Filmtech Japan, the leading international exhibition for high-performance films and advanced functional materials. At the event, HySum presented its latest achievements in key materials for electronics, semiconductors, optoelectronics, and precision components, further demonstrating its capabilities to global partners in next-generation functional film innovation.

Advanced Technologies Supporting High-Performance Functional Films

During the exhibition, HySum showcased solutions developed through its mature expertise in:

• Precision coating technologies

• Co-extrusion processes

• Multi-layer barrier film structures

These technologies enable the production of high-performance functional films designed for a wide range of applications, including:

• Consumer electronics

• Advanced semiconductor manufacturing processes

• Automotive-grade electronic components

• AI-driven optoelectronic modules

HySum’s materials provide stable, reliable environmental and functional protection for high-precision devices that require exceptional performance in demanding operating conditions.

A Comprehensive Portfolio Covering Diverse Electronic & Optoelectronic Applications

HySum presented a broad range of functional protective films tailored for electronics and optoelectronics, including:

• CPP high-adhesion protective films

• PE antistatic protective films

• Optical-grade antistatic films

• High-temperature–resistant protective films

• UV reduced-adhesion tapes

• PI high-temperature adhesive tapes

• Optical protective films

• Foam tapes for precision assembly

These materials support multiple application scenarios such as electronic Packaging, optoelectronic module protection, chip manufacturing, and component-level environmental barriers.

Delivering Multi-Scenario Solutions with High Barrier, Thermal Stability, and Structural Reliability

Focusing on core performance indicators—such as high barrier properties, thermal resistance, cleanliness levels, and dimensional stability—HySum is able to respond quickly to customer needs.
The company provides customizable, multi-scenario film solutions that meet the rigorous requirements of electronics manufacturing, semiconductor processing, optical module assembly, and automotive electronics.

HySum New Materials looks forward to deeper collaboration with partners around the world, working together to advance the high-performance film industry toward a future defined by higher quality, greater reliability, and lower carbon impact.